CCL, Copper Clad Laminate (CCL), referred to as copper clad plate, is a kind of composite material that is prepared by mixing reinforcement materials, resins and other auxiliary materials, and coated with copper foil on one or both sides, and finally made by hot pressing process.

Prepreg is an abbreviation of Pre-pregnant, meaning prepreg material, which refers to the thin sheet material impregnated with resin and cured to an intermediate degree (stage B). The semi-cured sheet can be used as the bonding material and interlayer insulation of the inner conductive pattern of the multi-layer printed board. During lamination, the semi-cured epoxy resin melts, flows and solidifies to bond the circuit layers together and form a reliable insulation layer.

Rigid copper-clad plate, a hard board for circuit boards, is mainly used to make circuit boards with high comprehensive performance requirements and high dimensional accuracy requirements, such as motherboards.

Flexible Copper Clad Laminate (FCCL) refers to the copper clad laminate formed by bonding with copper foil on one or both sides of flexible insulating materials such as polyester film or polyimide film through a certain process. It is a Flexible Printed Circuit board (FPC) processing substrate material, by copper foil, film, adhesive three different materials composite. Compared with rigid copper clad plate, flexible copper clad plate has the characteristics of light, thin and flexible.